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SMT贴片技术发展及业界课题
SMT Placement Technology Development and Industry lssues
— 薛广辉
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向两极不断延伸的元件贴装技术
Extending Component Placement Technology to Both Poles
— 胡婴
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第十七届卓越奖获奖者名单
Winners of the 17th Step-by-Step Excellence Awards
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第十七届卓越奖获奖产品简介
Winning Products of the 17th Step-by-Step Excellence Awards
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NEPCON ASIA 2023展后回顾
NEPCON ASIA 2023 Post Show Review
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浅谈SMT 首件检测领域的发展趋势
Introduction to Development Trend of SMT First Article Inspection
— 郑建华 深圳捷登智能
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一种解决天线馈针焊接的工艺设计方法
A Process Design Method to Solve the Problem of Antenna Feed Pin Welding
— 张峻宁/聂富刚/杨卫卫 中兴通讯
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贴片工艺技术创新与市场机遇
Mounting Process Technology Innovation and Market Opportunities
— 赵永先 北京中科同志科技
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中国电子组装市场从不确定到逐渐明朗的2024
China Electronics Assembly Market from Uncertainty to Gradual Clarity by 2024
—李家伦 富士德中国
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中小批量多品种生产模式下的表面贴装理想解决方案
An Ideal Solution for Surface Mounting in Small, Medium Batches and Multi-Variety Production Modes
—王英豪 Europlacer 中国
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高速高精度贴片机中的关键技术
Key Technologies in High-Speed and High-Precision Mounter
—孙昊 宁波亦唐智能科技/刘伟华 甬江实验室/于兴虎 宁波亦唐智能科技
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AI 在SMT 制造检验中的应用、进展和挑战
Application, Progress and Challenges of AI in SMT Inspection
—Roberto Yebra德律泰电子
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贴片机吸嘴智能清洗技术及应用
Intelligent Cleaning Technology and Application of Mounter Nozzle
—杨文雄 深圳市三捷机械设备
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